MediaTek has announced its latest chipset in the Helio X series, this time, it’s the Helio X30. The biggest change with the new chipset is that it has been shrunk down to 10nm (nanometers) from its predecessor, the X20’s, 20 nanometers. The X30 brings with it a whopping 10-cores which continues to show the company is trying to lead, and cut away from other chipset makers.
The X30 uses a three island design, it has:
- 2 x Cortex-A73 @ 2.8GHz
- 4 x Cortex-A53 @ 2.2GHz
- 4 x Cortex-A35 @ 2.0GHz
The X30 is able to support up to 8GB of RAM with its four LPDDR4X bays, 4K video recording and playback at 30fps with the PowerVR 7XTP-MT4 GPU (850MHz), and dual-cameras up to 28MP.
Alongside the high-end X30, MediaTek also took the opportunity to mention the Helio P20/P25 chips. Details of the Helio P25 were a bit thin but it’s expected to be a higher clocked version of the P20, which was recently released for sampling to manufacturers. The P20 will be 16 nanometers and have:
- 8 x A53 cores @ 2.3GHz
- Mali-T880 MP2 GPU @ 900MHz
- Up to 6GB of 1600MHz LPDDR4x RAM or up to 4GB of 933MHz LPDDR3 RAM
The chip will support hardware accelerated HEVC video decode at up to 4K 30Hz, video encoding at 4k 30Hz in h.264, support for 1920×1080 displays at 60Hz, category 6 LTE with 2x carrier aggregation with Dual-SIM Dual Standby support.
The high-end Helio X30 is expected to be released in the first quarter of 2017 meaning we could see devices shipping with the chip as soon as the summer of 2017.